R&D in Semiconductor Test Data Analysis and AI Technologies

We focus on research and development that solves manufacturing-site issues at their root through semiconductor test data analysis using AI and statistical methods.

As one result of these efforts, we have obtained a patent in Japan and are pursuing patent protection in the United States for the following technology.

Patent for Semiconductor Inspection Technology

Patent Title

Semiconductor Wafer Inspection Apparatus, Semiconductor Wafer Inspection Method, and Recording Medium

Patent Information

Japan Granted Patent No. 7898569

United States Patent Pending

Features

Contributes to high-precision detection of minute defects, yield improvement, and TAT reduction

Our Vision

Future Outlook

Building on this technology, we are advancing the practical application of multiple additional technologies.

By providing technologies that are truly useful on semiconductor manufacturing sites, we will contribute to the future of the industry.